Technical drawings available here to view and download
The trend subject lightweight design was a central
starting point of development activities for fastening
solutions into sandwich materials such as honeycomb
and foam structures and their diverse coatings.
With the thermal adhesive bonding boss TSSD®
EJOT developed a product and the corresponding
process to join components made of these materials
in a reliable way and with outstanding strength
properties. The TSSD® is the perfect solution
for applications in honeycomb and foam materials
which are a standard in aircraft interiors.
Function of the TSSD®:
-
The TSSD® is accelerated by the tooling
equipment to a specified rotational speed and is
pushed into the upper layer by a defined forward
feed.
-
The partly fused TSSD® element then penetrates
the component and flows into the hollow chambers
of the intermediate layer, forming a positive lock
and adhesive bond.
-
The TSSD® rotates till the final position is
reached, where it stops immediately. The tooling
equipment still performs an axial pressure onto
the TSSD® to give the fused polymer material
time for solidification. In the fused polymer mass,
parts of the layers and cores are entwined and
a positive lock and adhesive bond is
created.
Mechanical parameters (dependent of component)
-
Axial tensile strength approx. 800 N
-
Shear force approx. 1500 N
Standard TSSD® as
direct fastening element
TSSD® as screw boss
with metallic insert -
especially for aircrafts
Benefits of the EJOT TSSD® at a glance
-
Generates positive locking and adhesive bonding mechanisms
-
Generally no pre-hole necessary
-
Functions as screw boss for self-tapping screws or direct fastening element
-
Good mechanical characteristics
-
No excess time consumed in preparing the product.
-
No curing times